CHIMES

Center for Heterogeneous Integration of Micro Electronic Systems

The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogeneous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. This center is supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).

Advancing Semiconductor
Integration & Packaging

15 Partner Universities


Support from the SRC's JUMP 2.0, DARPA & Industry Partners

4 Research Themes

A Strong Team of Principal Investigators & Student Researchers

CHIMES Spring 2025 Newsletter

Check out the latest issue of the CHIMES quarterly newsletter. This issue features recent research highlights, student spotlights, PI and student achievements, upcoming events, and more!

CHIMES Wins Best Presentation Award at APEC 2025

Congratulations to CHIMES student Ramin Rahimzadeh Khorasani (Penn State), advised by Professor Madhavan Swaminathan, for receiving the Best Presentation Award at APEC 2025! 

CHIMES PI Michal Lipson Elected to National Academy of Engineering

Congratulations to CHIMES PI Michal Lipson (Columbia University) on being elected to the National Academy of Engineering (NAE) for "the development, fabrication, and implementation of building blocks of silicon photonics."

CHIMES PI Zhiting Tian Earns Presidential Early Career Award

Congratulations to CHIMES PI Zhiting Tian (Cornell University). Professor Tian has been selected for the prestigious Presidential Early Career Award for Scientists and Engineers (PECASE).

What a year 2024 has been for CHIMES!

Two years in, the Center's success is a testament to the passion, dedication, and teamwork of everyone involved in our mission.


This year has been one of incredible progress, marked by progressive research, collaborative breakthroughs, and the hard work and dedication of our students and PIs to push the boundaries of semiconductor packaging and heterogeneous integration innovation.


Special thanks to the Semiconductor Research Corporation (SRC), Defense Advanced Research Projects Agency (DARPA) and our Industry Sponsors for their unwavering support throughout the Center's first two years!

Looking forward to all the great work that is to come out of CHIMES in 2025!

Upcoming Events

Learn more about the exciting research being done at CHIMES by meeting our students and PIs at these upcoming conferences!