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Center for Heterogeneous Integration of Micro Electronic Systems

The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogeneous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. This center is supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).


  • Contact Us
  • Madhavan Swaminathan
    CHIMES Director, Head of the Department of Electrical Engineering, and William E. Leonhard Chair Professor of Electrical Engineering
    mvs7249@psu.edu
 
 

About

The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogenous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. 

Center for Heterogeneous Integration of Micro Electronic Systems

The Pennsylvania State University

University Park, PA 16802